Advancement in microelectronics is responsible for the transformation in the communication and computation over the last few decades. The personal electronics have become so integrated with our life that many probably can’t live without them. In the heart of these transformations are the miniaturisation of the microelectronics and its packaging.
The increased portability of electronics products made possible by minitualisation of microelectronics has rendered the electronic components and the interconnections within vulnerable that is aggravated by the adoption of lead-free solders, which tends to be more vulnerable to high strain rate loading such as the case of drop-impact. A fundamental understanding of the propagation of cracks in the solder joints under the condition of low cycle fatigue at high strain rate is needed to develop a predictive model for the drop-impact life of the solder joints in portable electronic products. This research will build upon the previous research performed under consort